Flatness & Planarity Measurement
Multi-functional Surface Profiling Interferometer
Multi-functional Surface Profiling Interferometer
WLI-4100 Series

·  Nanometer-level accuracy with full-area scanning over a 200×200 mm large field of view.

·  Capable of measuring the parallelism of two sides on workpieces with steps up to 70 mm.

·  Equipped with a spectral module to simultaneously inspect surface profile and roughness.

·  Automatic measurement and intelligent judgment, ideal for full batch inspection.

·  Proprietary optical path enables simultaneous dual-side scanning for accurate thickness and parallelism measurement.

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Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.
Micro 3D White Light Interferometer
Micro 3D White Light Interferometer
WLI-6050 Series

·  Features a 14mm large field of view and combined multiple objectives, enabling both wide-range observation and precision measurement.

·  One-touch automatic leveling and focusing supports long-distance measurement, suitable for deep holes and high-drop inspection.

·  Integrates interferometric analysis and true-color imaging for clear details and intuitive, comprehensive measurement.

·  One-click full-area roughness detection with a wide measuring range, compatible with various workpieces.

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Boasting an extra-large single field of view of 14 mm, it is equipped with a 0.6× lightweight lens and a 4-objective turret. One unit fulfills all requirements for wide-field observation and high-precision measurement.
Boasting an extra-large single field of view of 14 mm, it is equipped with a 0.6× lightweight lens and a 4-objective turret. One unit fulfills all requirements for wide-field observation and high-precision measurement.
Equipped with one-touch automatic tilt leveling and dual closed-loop precision focusing. Easy to operate, it supports continuous measurement up to 100 mm and suits inspection of deep holes with large height differences.
Equipped with one-touch automatic tilt leveling and dual closed-loop precision focusing. Easy to operate, it supports continuous measurement up to 100 mm and suits inspection of deep holes with large height differences.
One-click full-area roughness measurement with a wide measuring range, enabling accurate detection of surface roughness ranging from ultra-smooth mirror surfaces to highly rough additive-manufactured workpieces.
One-click full-area roughness measurement with a wide measuring range, enabling accurate detection of surface roughness ranging from ultra-smooth mirror surfaces to highly rough additive-manufactured workpieces.
Featuring proprietary optical path and layered scanning, it delivers accurate film thickness measurement and detects bottom profiles by penetrating transparent layers.
Featuring proprietary optical path and layered scanning, it delivers accurate film thickness measurement and detects bottom profiles by penetrating transparent layers.
It retains black-and-white interferometric analysis and integrates RGB true-color imaging, restoring the topography and color details of samples for comprehensive measurement and intuitive analysis.
It retains black-and-white interferometric analysis and integrates RGB true-color imaging, restoring the topography and color details of samples for comprehensive measurement and intuitive analysis.
Supports one-click automatic inspection report generation and is compatible with MES systems, enabling seamless upload and synchronization of measurement data.
Supports one-click automatic inspection report generation and is compatible with MES systems, enabling seamless upload and synchronization of measurement data.
Triangulation-based 3D Optical Profiler
Triangulation-based 3D Optical Profiler
Delta Series

·  Compatible with workpieces of various materials. No surface treatment is required for efficient and convenient inspection.

·  Delivers sub-micron high precision. Large-field measurement is available without stitching, with optional multiple probes.

·  Adopts layered scanning technology to penetrate the surface and accurately detect internal structural features.

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No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.