High-Throughput Wafer Thickness Measurement System
High-Throughput Wafer Thickness Measurement System
Learn More
Wafer Thickness Measurement System
High-Throughput Wafer Thickness Measurement System
公司新闻
High-Throughput Wafer Thickness Measurement System
TBW-2000 Series

·  Intuitive and easy-to-use controls; data can be exported for traceability.

·  Comprehensive surface profile parameters for wafers including TTV, BOW, WARP, LTV and SOR.

·  High-order residual comparison and analysis for accurate topography deviation evaluation.

·  Compatible with diverse samples such as high/low reflectivity silicon wafers, composite substrates and thin films.

·  Adaptable to long-distance operating conditions to strictly control nano-level thinning processes.

·  Customizable integrated EFEM solutions available.

Download

Expand

Fold up

Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Customized all-in-one EFEM solutions are available per customer requirements.
Customized all-in-one EFEM solutions are available per customer requirements.