Diffraction Grating Fabrication
Diffraction Grating Fabrication
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Grating and Superstructure Fabrication
Grating and Superstructure Fabrication
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Silicon Nitride Optical Waveguide
Silicon Nitride Optical Waveguide
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Lithium Niobate Optical Waveguide Fabrication
Lithium Niobate Optical Waveguide Fabrication
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Silicon Optical Waveguide
Silicon Optical Waveguide
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Ybrid Bonding Wafer Foundry
Ybrid Bonding Wafer Foundry
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RDL Wafer Fabrication
RDL Wafer Fabrication
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Deep Silicon Etching Fabrication
Deep Silicon Etching Fabrication
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Thin Film Flexible Electrode Fabrication
Thin Film Flexible Electrode Fabrication
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Photonic Wire Bonding
Photonic Wire Bonding
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Micro-nano Pattern Foundry Service
Diffraction Grating Fabrication
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Diffraction Grating Fabrication
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Reflective Grating, Step-and-Scan Lithography, 500 nm
Reflective Grating, Step-and-Scan Lithography, 500 nm
Grating Phase Plate, Step-and-Scan Lithography
Grating Phase Plate, Step-and-Scan Lithography
Silicon Grating, Laser Direct Writing
Silicon Grating, Laser Direct Writing
Transmission Grating, 2 μm, Contact Lithography
Transmission Grating, 2 μm, Contact Lithography
Transmission Grating, Step-and-Scan Lithography, 180 nm
Transmission Grating, Step-and-Scan Lithography, 180 nm
Transmission grating and reflection grating with anti-reflection coating
Transmission grating and reflection grating with anti-reflection coating
Grating and Superstructure Fabrication
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Grating and Superstructure Fabrication
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案例1：Ta2O5-超结构
案例1：Ta2O5-超结构
案例2：Ta2O5 超结构
案例2：Ta2O5 超结构
案例3：Ta2O5 超结构
案例3：Ta2O5 超结构
案例4：GaN超结构
案例4：GaN超结构
案例5：GaN超结构
案例5：GaN超结构
案例6：GaN超结构
案例6：GaN超结构
Silicon Nitride Optical Waveguide
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Silicon Nitride Optical Waveguide
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Top cladding: SiO₂ deposited by PECVD, 800 nm-thick SiO₂ grown via PECVD
Top cladding: SiO₂ deposited by PECVD, 800 nm-thick SiO₂ grown via PECVD
Top cladding with SiO₂ grown by PECVD; Coverage performance of 800 nm SiO₂ deposited via PECVD
Top cladding with SiO₂ grown by PECVD; Coverage performance of 800 nm SiO₂ deposited via PECVD
Top cladding: SiO₂ grown by PECVD; Macro image of 800 nm SiO₂ deposited via PECVD
Top cladding: SiO₂ grown by PECVD; Macro image of 800 nm SiO₂ deposited via PECVD
Silicon Nitride (SiN) fabricated by ICP etching, compatible with 200 nm and 400 nm etching processes.
Silicon Nitride (SiN) fabricated by ICP etching, compatible with 200 nm and 400 nm etching processes.
Silicon Nitride (SiN) fabricated via ICP etching. The etching selectivity remains stably at 1.5. Etching uniformity of 6-inch wafers is less than 3% with excellent consistency.
Silicon Nitride (SiN) fabricated via ICP etching. The etching selectivity remains stably at 1.5. Etching uniformity of 6-inch wafers is less than 3% with excellent consistency.
Silicon Nitride (SiN) formed by ICP etching, sidewall verticality over 88°, well-defined profile
Silicon Nitride (SiN) formed by ICP etching, sidewall verticality over 88°, well-defined profile
Lithium Niobate Optical Waveguide Fabrication
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Lithium Niobate Optical Waveguide Fabrication
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LN Modulator Bandwidth: 60 GHz
LN Modulator Bandwidth: 60 GHz
Q factor of All-Pass Microring: 1×10⁶
Q factor of All-Pass Microring: 1×10⁶
Grating Coupler Loss: 8 dB
Grating Coupler Loss: 8 dB
Directional Coupler
Directional Coupler
1×2 MMI Insertion Loss: 0.2 dB
1×2 MMI Insertion Loss: 0.2 dB
Crossed waveguide loss: 0.02 dB
Crossed waveguide loss: 0.02 dB
Silicon Optical Waveguide
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Silicon Optical Waveguide
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Microring modulator: 30 GHz bandwidth
Microring modulator: 30 GHz bandwidth
Crossed waveguide loss: 0.028 dB per unit
Crossed waveguide loss: 0.028 dB per unit
Heating electrode: TiN thermal electrode
Heating electrode: TiN thermal electrode
Electro-optic switch extinction ratio: 45 dB
Electro-optic switch extinction ratio: 45 dB
All-Pass Micro-ring Q: 10 to the power of 5
All-Pass Micro-ring Q: 10 to the power of 5
1×2 MMI Insertion Loss: 0.043 dB per port
1×2 MMI Insertion Loss: 0.043 dB per port
Ybrid Bonding Wafer Foundry
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Ybrid Bonding Wafer Foundry
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Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
RDL Wafer Fabrication
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RDL Wafer Fabrication
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TSV
TSV
Tall Cu Post
Tall Cu Post
Micro Bump
Micro Bump
Hybrid bonding
Hybrid bonding
Fan out
Fan out
Al-bondpad
Al-bondpad
Deep Silicon Etching Fabrication
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Deep Silicon Etching Fabrication
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Case 1: Deep Silicon Etching
Case 1: Deep Silicon Etching
Case 2: Deep Silicon Etching
Case 2: Deep Silicon Etching
Case 3: Deep Silicon Etching
Case 3: Deep Silicon Etching
Case 4: Deep Silicon Etching
Case 4: Deep Silicon Etching
Case 5: Deep Silicon Etching
Case 5: Deep Silicon Etching
Case 6: Deep Silicon Etching
Case 6: Deep Silicon Etching
Thin Film Flexible Electrode Fabrication
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Thin Film Flexible Electrode Fabrication
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Case 1: Flexible Electrode for MEMS Process
Case 1: Flexible Electrode for MEMS Process
Case 2: Interdigital Electrode
Case 2: Interdigital Electrode
Case 3: Interdigital Electrode
Case 3: Interdigital Electrode
Case 4: Flexible Electrode for MEMS Process
Case 4: Flexible Electrode for MEMS Process
Case 5: Polymer Thin Film Electrode
Case 5: Polymer Thin Film Electrode
Case 6: Polymer Thin Film Electrode
Case 6: Polymer Thin Film Electrode