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Microscopic Optical 3D Metrology
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Surface Figure Accuracy - PV - RMS Parameters
Micro-nano Pattern Coplanarity
Multi-layer Film Thickness Analysis
Freeform Surface - Profile Tolerance Comparison
Macro Optical 3D Measurement
Multi-surface Parallelism Measurement
Geometric Tolerance Measurement
Angle and Radius R Measurement
Plane Step Height
Flatness & Planarity Measurement
Wafer TTV Bow Warp Measurement
Deep Hole 3D Profile Measurement
Non-transparent Top-Bottom Thickness Uniformity
Curved Surface R Measurement
Micro Optical Dynamic Vibration Testing
MEMS Pressure Sensing
MENS
MEMS Comb Drive
MEMS Comb Drive
TTV Thickness Uniformity
3D Laser Doppler Vibrometry
MEMS Cantilever
MEMS Microphone
Macro Optical Dynamic Vibration Testing
Ultrasonic Welding Experimental Modal Testing
Aero Turbine Blade 3D Dynamic Vibration Test
Vehicle NVH Analysis
UAV Wing Vibration
Flowmeter
Speed Sensor
Speaker 3D Vibration Analysis
Dynamic 3D Vibration Testing
Optical 3D Testing Service
White‑Light Interferometry Imaging System
Laser Coherent Imaging System
Triangulation‑based Optical 3D Profiler
Wafer Thickness Measurement System
Micro‑Dynamic Vibration Measuring System
Micro-nano Pattern Foundry Service
Micro‑Nano Optics
6‑inch PIC
Advanced Packaging
Device Fabrication
Micro-nano Laser Processing Service
Laser Drilling
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Laser Beam Shaping Module
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Optical Profilometry
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Micro-Nano Laser Processing
Laser Beam Shaping
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Ybrid Bonding Wafer Foundry
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RDL Wafer Fabrication
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Ultra-thin Wafer
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Conductive and Semi-Insulating SiC Wafer
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Composite Substrate
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Various Silicon Wafers & Test Wafers
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LN LT BaF₂
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Micro-nano Pattern Foundry Service
Advanced Packaging
Advanced Packaging
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Ybrid Bonding Wafer Foundry
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Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
Bonding Result Demonstration
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RDL Wafer Fabrication
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TSV
Tall Cu Post
Micro Bump
Hybrid bonding
Fan out
Al-bondpad
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Thin & Thick Film Thermal Oxide Wafer
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6寸 高阻热氧片 电阻率1 Ω·m
6寸 专用热氧片 热氧层厚度4.7um
8寸 高阻热氧片 电阻率1 Ω·m
8寸 专用热氧片 热氧层厚度4.7um
常规厚膜热氧片 热氧层厚度：500nm、1um、2um、3um
定制热氧片服务 6 8英寸设备，一炉100片，高效低成本
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Glass Wafer & High Refractive Index Glass Wafer
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玻璃晶圆及高折率玻璃晶圆(05251801158)(05251801208)(05251801269)
玻璃晶圆及高折率玻璃晶圆
玻璃晶圆及高折率玻璃晶圆(05251801158)
玻璃晶圆及高折率玻璃晶圆(05251801207)
玻璃晶圆及高折率玻璃晶圆(05251801158)(05251801208)
玻璃晶圆及高折率玻璃晶圆(05251801207)(05251801269)
公司新闻
Ultra-thin Wafer
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Ultra-thin Wafer
Conductive and Semi-Insulating SiC Wafer
LN LT BaF₂
Composite Substrate
Advanced Materials
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Conductive and Semi-Insulating SiC Wafer
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Composite Substrate
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Various Silicon Wafers & Test Wafers
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LN LT BaF₂
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Technical Concept
Optical Profilometry
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Micro-Nano Laser Processing
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Laser Beam Shaping
Strictly control pixel forming precision...
Correlation between Poor Surface Flatnes...
Correlation between Poor Flatness of the...
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