Triangulation-based 3D Optical Profiler
Triangulation-based 3D Optical Profiler
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Triangulation‑based Optical 3D Profiler
Triangulation-based 3D Optical Profiler
公司新闻
Triangulation-based 3D Optical Profiler
Delta Series

·  Compatible with workpieces of various materials. No surface treatment is required for efficient and convenient inspection.

·  Delivers sub-micron high precision. Large-field measurement is available without stitching, with optional multiple probes.

·  Adopts layered scanning technology to penetrate the surface and accurately detect internal structural features.

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No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.