·  Ultra-high precision positioning: XY accuracy ±2μm, galvanometer positioning <1μm (3σ)

·  High stability and high yield of laser: energy fluctuation <1.7%, with a minimum spot size of 5.5μm (optional)

·  Intelligent visual alignment: automatic probe alignment accuracy ±4μm, eliminating the need for manual adjustment

·  Integrated measurement and tuning closed loop: probe station + laser trimming integration, seamlessly interfacing with ATE

·  Strong mass production adaptability: Supports 100–200mm wafers, with automatic loading and unloading of 50 wafers

·  Compatibility with standard production lines: SECS/GEM, GPIB universal interfaces, meaning it can be plugged into production lines

· No damage during cold processing: ultra-short pulse cold processing, no cracks, no chipping, no thermal damage

· Ultra-high precision in micrometers: minimum hole diameter of 50μm, with a machining cone angle of approximately 10°

· Ultra-fast processing efficiency: alumina drilling takes as low as 0.4s per hole, eliminating the need for post-processing

· Full material and full process: compatible with Al₂O₃/AlN/SiC, drilling/scribing/cavity processing all in one machine

· High-power multi-light source: up to 1000W, supports 3-light source linkage

· Easy integration for mass production: Standard industrial interfaces, compatible with automated production lines and MES docking

· Cold processing without damage: ultra-short pulse laser, no carbonization, no delamination, low thermal impact

· Ultra-high precision: minimum hole diameter of 5μm, positioning accuracy **±10μm**

· High-efficiency mass production: microporous drilling at 4000 holes/second, cutting at 1.3m/s, with doubled production capacity through dual workstations

· Universal compatibility: Compatible with ABF/FR4/flexible boards, integrating multiple processes such as drilling and cutting

· Material saving and quality improvement: The cutting gap is less than 0.4mm, resulting in a 78% increase in material utilization rate

·  Easy integration: Supports automation and MES integration, adapting to high-end PCB mass production

· Micron-level high-precision cutting: accuracy ±25μm, visual automatic alignment

· Laser non-destructive processing: stress-free, residue-free, post-processing-free

· Double efficiency with dual heads: automated loading and unloading, 24/7 mass production

· Full material and full scene compatibility: compatible with FR4 / ceramic / IMS, with no worries for complex contours

· Zero consumables and low cost: no tool wear, significantly reduced operation and maintenance costs

· Smart production line plug-and-play: standard industrial interface, supporting MES integration and traceability

· High-precision measurement: measuring range from 5mΩ to 1GΩ, with measurement repeatability far superior to that of peers

· Precise positioning: positioning accuracy **±5μm**, wafer-level accuracy up to **＜1μm**

· Yield improvement: Professional closed-loop resistance adjustment, resulting in an overall yield improvement of 7%+

High speed and efficiency: Optimized convergence algorithm, leading in industry with full-range fine-tuning speed

· Universal compatibility: Multiple lasers are available, compatible with thick/thin films, sensors, chip resistors, and wafers

Easy integration for mass production: Supports SECS/GEM, comes with built-in traceability, and is compatible with automotive-grade high Cpk mass production