Wafer TTV Bow Warp Measurement
High-Throughput Wafer Thickness Measurement System
High-Throughput Wafer Thickness Measurement System
TBW-2000 Series

·  Intuitive and easy-to-use controls; data can be exported for traceability.

·  Comprehensive surface profile parameters for wafers including TTV, BOW, WARP, LTV and SOR.

·  High-order residual comparison and analysis for accurate topography deviation evaluation.

·  Compatible with diverse samples such as high/low reflectivity silicon wafers, composite substrates and thin films.

·  Adaptable to long-distance operating conditions to strictly control nano-level thinning processes.

·  Customizable integrated EFEM solutions available.

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Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Customized all-in-one EFEM solutions are available per customer requirements.
Customized all-in-one EFEM solutions are available per customer requirements.
Multi-functional Surface Profiling Interferometer
Multi-functional Surface Profiling Interferometer
WLI-4100 Series

·  Nanometer-level accuracy with full-area scanning over a 200×200 mm large field of view.

·  Capable of measuring the parallelism of two sides on workpieces with steps up to 70 mm.

·  Equipped with a spectral module to simultaneously inspect surface profile and roughness.

·  Automatic measurement and intelligent judgment, ideal for full batch inspection.

·  Proprietary optical path enables simultaneous dual-side scanning for accurate thickness and parallelism measurement.

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Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.