Microscopic Dynamic 3D Vibration Measurement System
Microscopic Dynamic 3D Vibration Measurement System
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Micro‑Dynamic Vibration Measuring System
Microscopic Dynamic 3D Vibration Measurement System
公司新闻
Microscopic Dynamic 3D Vibration Measurement System
MDV-3050 Series

·  Non-contact and non-destructive testing with no additional load; suitable for ultra-thin and miniature devices.

·  Ultra-high precision with sub-picometer displacement resolution. Features tiny measuring spots for accurate testing on micro areas.

·  Ultra-wide frequency range from DC up to GHz, covering both low and high frequency vibrations.

·  Simultaneous 3D measurement; in-plane and out-of-plane vibrations are acquired integrally with full-field vibration mode visualization.

·  Patented IRIS silicon-transparent measurement technology enables testing of encapsulated internal chips without decapsulation.

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It accurately measures vibration parameters and modes of MEMS microphone diaphragms to quickly identify structural defects. Actual test data is compared with simulation results for structural optimization, improving acoustic sensitivity and frequency response.
It accurately measures vibration parameters and modes of MEMS microphone diaphragms to quickly identify structural defects. Actual test data is compared with simulation results for structural optimization, improving acoustic sensitivity and frequency response.
Detects vibration and deformation of pressure sensing diaphragms, identifies stress and process defects. Optimizes structures by correlating tests with simulations to enhance precision and response. Suitable for reliability tests and mass production quality inspection.
Detects vibration and deformation of pressure sensing diaphragms, identifies stress and process defects. Optimizes structures by correlating tests with simulations to enhance precision and response. Suitable for reliability tests and mass production quality inspection.
Measures vibration modes, resonant frequency and deformation of MEMS cantilevers, detects stress defects. Structural optimization is realized through test-simulation correlation to boost sensing sensitivity. Ideal for R&D tuning and mass production quality inspection.
Measures vibration modes, resonant frequency and deformation of MEMS cantilevers, detects stress defects. Structural optimization is realized through test-simulation correlation to boost sensing sensitivity. Ideal for R&D tuning and mass production quality inspection.
It measures vibration modes, natural frequency and deformation distribution of pressure sensor diaphragms, detects uneven stress and process defects. Structural optimization is achieved by comparing measured data with simulation results.
It measures vibration modes, natural frequency and deformation distribution of pressure sensor diaphragms, detects uneven stress and process defects. Structural optimization is achieved by comparing measured data with simulation results.
Detects high-frequency vibration modes and frequency response of CMUT diaphragms to identify defects. Optimizes structures via test-simulation comparison for higher transduction efficiency and wider bandwidth, and calibrates consistency of array elements.
Detects high-frequency vibration modes and frequency response of CMUT diaphragms to identify defects. Optimizes structures via test-simulation comparison for higher transduction efficiency and wider bandwidth, and calibrates consistency of array elements.
Detects in-plane vibration and frequency response of comb-type MEMS devices to acquire resonance parameters and mode shapes and verify driving efficiency. Structural optimization based on test-simulation comparison improves linearity.
Detects in-plane vibration and frequency response of comb-type MEMS devices to acquire resonance parameters and mode shapes and verify driving efficiency. Structural optimization based on test-simulation comparison improves linearity.