·  Ultra-high precision positioning: XY accuracy ±2μm, galvanometer positioning <1μm (3σ)

·  High stability and high yield of laser: energy fluctuation <1.7%, with a minimum spot size of 5.5μm (optional)

·  Intelligent visual alignment: automatic probe alignment accuracy ±4μm, eliminating the need for manual adjustment

·  Integrated measurement and tuning closed loop: probe station + laser trimming integration, seamlessly interfacing with ATE

·  Strong mass production adaptability: Supports 100–200mm wafers, with automatic loading and unloading of 50 wafers

·  Compatibility with standard production lines: SECS/GEM, GPIB universal interfaces, meaning it can be plugged into production lines

· High-precision measurement: measuring range from 5mΩ to 1GΩ, with measurement repeatability far superior to that of peers

· Precise positioning: positioning accuracy **±5μm**, wafer-level accuracy up to **＜1μm**

· Yield improvement: Professional closed-loop resistance adjustment, resulting in an overall yield improvement of 7%+

High speed and efficiency: Optimized convergence algorithm, leading in industry with full-range fine-tuning speed

· Universal compatibility: Multiple lasers are available, compatible with thick/thin films, sensors, chip resistors, and wafers

Easy integration for mass production: Supports SECS/GEM, comes with built-in traceability, and is compatible with automotive-grade high Cpk mass production