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· Features a 14mm large field of view and combined multiple objectives, enabling both wide-range observation and precision measurement.
· One-touch automatic leveling and focusing supports long-distance measurement, suitable for deep holes and high-drop inspection.
· Integrates interferometric analysis and true-color imaging for clear details and intuitive, comprehensive measurement.
· One-click full-area roughness detection with a wide measuring range, compatible with various workpieces.
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· Nanometer-level accuracy with full-area scanning over a 200×200 mm large field of view.
· Capable of measuring the parallelism of two sides on workpieces with steps up to 70 mm.
· Equipped with a spectral module to simultaneously inspect surface profile and roughness.
· Automatic measurement and intelligent judgment, ideal for full batch inspection.
· Proprietary optical path enables simultaneous dual-side scanning for accurate thickness and parallelism measurement.
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