PCBA Laser Processing
PCBA Laser Processing
Learn More
Laser Cleaving
PCBA Laser Processing
公司新闻
PCBA Laser Processing

· Micron-level high-precision cutting: accuracy ±25μm, visual automatic alignment

· Laser non-destructive processing: stress-free, residue-free, post-processing-free

· Double efficiency with dual heads: automated loading and unloading, 24/7 mass production

· Full material and full scene compatibility: compatible with FR4 / ceramic / IMS, with no worries for complex contours

· Zero consumables and low cost: no tool wear, significantly reduced operation and maintenance costs

· Smart production line plug-and-play: standard industrial interface, supporting MES integration and traceability

Download

Expand

Fold up

FR4, 1.6 mm – Machining result of nanosecond laser
FR4, 1.6 mm – Machining result of nanosecond laser
PI, 150 μm – Machining result of picosecond laser
PI, 150 μm – Machining result of picosecond laser
Process difference between milling cutter cutting and laser cutting
Process difference between milling cutter cutting and laser cutting
Green nanosecond laser. Micrograph perpendicular to the cutting direction for kerf taper angle measurement.
Green nanosecond laser. Micrograph perpendicular to the cutting direction for kerf taper angle measurement.
Micrograph of cutting sidewall by green nanosecond laser
Micrograph of cutting sidewall by green nanosecond laser
Micrograph of the top material surface after singulation by green nanosecond laser (Material thickness: 0.8 mm)
Micrograph of the top material surface after singulation by green nanosecond laser (Material thickness: 0.8 mm)