High-Throughput Wafer Thickness Measurement System
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Product Details
Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Visual measurement and control system with intuitive operation. It supports data analysis, export and traceability, and delivers stable data for precision measurement.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
Compliant with SEMI standards, it can measure full-range surface profile parameters of wafers including TTV, BOW, WARP, LTV and SOR.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
It supports high-order residual comparison and analysis based on designated reference models, accurately identifying various surface topography and profile deviations, and providing reliable quantitative data for quality evaluation and precision verification.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
The device features wide compatibility and can accurately measure various samples such as heavily doped wafers, rough wafers, low-reflection birefringent substrates, multi-layer composite wafers and thin films.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Modular and customizable structure adapts to working conditions at a distance of over 1 meter. Equipped with a precision monitoring system, it enables full-process accurate control of nano-scale thinning processing.
Customized all-in-one EFEM solutions are available per customer requirements.
Customized all-in-one EFEM solutions are available per customer requirements.
Specification Technology

高通量晶圆测厚系统

Product Catalogue

Chinese‑English Catalog

For details, please refer to the product catalog.

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