Laser Micro-nano Circuit Resistance Trimming
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Digital-Link
Serpentine-Cut
Serpentine-Cut
Ablation of NiCrSi in pressure sensor, line width: 32 μm
Ablation of NiCrSi in pressure sensor, line width: 32 μm
Precise cutting of 5 μm link
Precise cutting of 5 μm link
Sensor thin film ablation: removal of NiCr film on top of SiO₂ layer
Sensor thin film ablation: removal of NiCr film on top of SiO₂ layer
Resistor trimming process: Mode P features fast speed yet low precision; Mode D delivers high precision with limited sheet resistance compatibility; Mode L offers high precision and wide sheet resistance adaptability; Mode M provides significant resistance increment. Scanning edge trimming supports high-voltage isolation and custom settings.
Resistor trimming process: Mode P features fast speed yet low precision; Mode D delivers high precision with limited sheet resistance compatibility; Mode L offers high precision and wide sheet resistance adaptability; Mode M provides significant resistance increment. Scanning edge trimming supports high-voltage isolation and custom settings.
Specification Technology

一、核心技术优势

激光微纳线路调阻


二、解决的行业痛点

激光微纳线路调阻


三、详细技术规格

激光微纳线路调阻


Product Catalogue

Chinese‑English Catalog

For details, please refer to the product catalog.

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