PCB Laser Processing
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Product Details
Opening aperture: 10 μm, bottom aperture: 7 μm
Opening aperture: 10 μm, bottom aperture: 7 μm
Opening aperture: 20 μm, bottom aperture: 15 μm
Opening aperture: 20 μm, bottom aperture: 15 μm
Opening aperture: 25 μm, bottom aperture: 20 μm
Opening aperture: 25 μm, bottom aperture: 20 μm
Standard UV chemical curing is prone to thermal accumulation deformation and rough edges. Picosecond laser cold processing causes no thermal damage, delivering sharp edges and far higher precision than UV curing.
Standard UV chemical curing is prone to thermal accumulation deformation and rough edges. Picosecond laser cold processing causes no thermal damage, delivering sharp edges and far higher precision than UV curing.
Single-pulse and pulse sequence drilling are suitable for high-volume production. They enable precision micro-hole machining with high efficiency, regular hole shapes and excellent consistency.
Single-pulse and pulse sequence drilling are suitable for high-volume production. They enable precision micro-hole machining with high efficiency, regular hole shapes and excellent consistency.
Circular cutting is suitable for forming large apertures above 30 μm. It enables controllable hole wall taper, improves hole wall smoothness and precision, and meets the requirements of high-end precision processes.
Circular cutting is suitable for forming large apertures above 30 μm. It enables controllable hole wall taper, improves hole wall smoothness and precision, and meets the requirements of high-end precision processes.
Specification Technology

一、核心技术优势

PCB激光切裂钻孔设备


二、解决的行业痛点

PCB激光切裂钻孔设备


三、详细技术规格

PCB激光切裂钻孔设备


Product Catalogue

Chinese‑English Catalog

For details, please refer to the product catalog.

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