PCBA Laser Processing
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Product Details
FR4, 1.6 mm – Machining result of nanosecond laser
FR4, 1.6 mm – Machining result of nanosecond laser
PI, 150 μm – Machining result of picosecond laser
PI, 150 μm – Machining result of picosecond laser
Process difference between milling cutter cutting and laser cutting
Process difference between milling cutter cutting and laser cutting
Green nanosecond laser. Micrograph perpendicular to the cutting direction for kerf taper angle measurement.
Green nanosecond laser. Micrograph perpendicular to the cutting direction for kerf taper angle measurement.
Micrograph of cutting sidewall by green nanosecond laser
Micrograph of cutting sidewall by green nanosecond laser
Micrograph of the top material surface after singulation by green nanosecond laser (Material thickness: 0.8 mm)
Micrograph of the top material surface after singulation by green nanosecond laser (Material thickness: 0.8 mm)
Specification Technology

一、核心技术优势

PCBA激光分板设备


二、解决的行业痛点

PCBA激光分板设备


三、详细技术规格

PCBA激光分板设备


Product Catalogue

Chinese‑English Catalog

For details, please refer to the product catalog.

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