Wafer Laser Repair Equipment
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Product Details
Resistor trimming process:P: Fast cutting speed with moderate precision；D: High precision, suitable for low sheet resistance；L: High precision, compatible with various sheet resistance values；M: Significant resistance adjustment range；Edge trimming: Scanning cutting supports high-voltage isolation and custom settings
Resistor trimming process:P: Fast cutting speed with moderate precision；D: High precision, suitable for low sheet resistance；L: High precision, compatible with various sheet resistance values；M: Significant resistance adjustment range；Edge trimming: Scanning cutting supports high-voltage isolation and custom settings
Sensor thin film ablation: Removal of SiO₂ top layer and NiCr thin film
Sensor thin film ablation: Removal of SiO₂ top layer and NiCr thin film
Precise cutting of 5 μm interconnect lines
Precise cutting of 5 μm interconnect lines
Pressure Sensor - NiCrSi Ablation, Line Width: 32 μm
Pressure Sensor - NiCrSi Ablation, Line Width: 32 μm
Serpentine-Cut
Serpentine-Cut
Digital-Link
Digital-Link
Specification Technology

一、核心技术优势

晶圆激光修复设备


二、解决的行业痛点

晶圆激光修复设备


三、详细技术规格

晶圆激光修复设备


Product Catalogue

Chinese‑English Catalog

For details, please refer to the product catalog.

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