Based on the principle of low-coherence interferometry, the white light interferometer performs non-contact 3D microscopic topography measurement on object surfaces. It is capable of measuring nanometer to micrometer scale parameters including surface roughness, flatness, step height and thin film thickness. Widely applied in semiconductors, optics, MEMS and precision manufacturing, it serves for process monitoring, quality inspection and scientific research.

The surface figure interferometer adopts interferometric detection to perform non-contact and precise measurement of flatness, curvature, surface figure accuracy and fringe error of workpieces such as optical components and wafers. It is widely used for quality inspection and alignment in the processing of optical lenses and precision mirrors. The device quickly identifies deviations in surface topography to guarantee the imaging performance and operational accuracy of optical devices.

Leveraging laser coherence characteristics, the laser coherent imaging system delivers high-precision imaging. It enables non-contact observation of micro topography, internal defect detection, deformation and displacement measurement, as well as 3D dimension metrology. Widely applied to precision parts, optical components and semiconductor devices, it supports product quality verification, process inspection and microstructure analysis.

This wafer thickness measurement system is specially designed for semiconductor wafers. It conducts non-contact and precise measurement of overall thickness, warpage, flatness and edge thickness variation of wafers. Compatible with substrates such as silicon and silicon carbide, it is applied to chip process control, wafer sorting and process verification. It strictly controls substrate machining accuracy and improves the yield of semiconductor products.

The optical triangulation 3D profilometer adopts the laser triangulation ranging principle to perform fast non-contact 3D profile scanning of workpieces. It can measure profile dimensions, height difference, flatness, radian and profile deviation. Suitable for electronic components, precision hardware and plastic parts, it is widely used in mass industrial quality inspection, profile mapping and dimensional tolerance testing.

The microscopic dynamic 3D vibration measurement system captures the 3D vibration status of micro components accurately in a non-contact manner. It measures amplitude, frequency, deformation and vibration modes. Suitable for MEMS devices, precision parts and micro structures, it is applied to vibration characteristic analysis, structural performance inspection, operating condition testing and product reliability verification.

Laser trimming uses laser precision etching to adjust resistance values and correct resistance deviations efficiently in a non-contact way. It is applicable to electronic components such as chip resistors, thick film circuits and sensors. The system quickly calibrates electrical parameters to bring resistances within standard ranges, improving component accuracy and consistency to meet the tuning requirements of precision electronics manufacturing.

High-energy laser beams are applied in laser drilling to fabricate micro holes with high precision, including through holes and blind holes. It works with diverse materials such as metals, ceramics, wafers and thin films. Widely adopted in precision components, semiconductors and optical parts, this technology delivers fine hole diameters and superior accuracy. It efficiently completes machining of various micro holes to meet the demands of precision manufacturing.

Laser scribing achieves non-destructive separation via laser-induced thermal stress and is specially designed for processing brittle materials such as glass, ceramics and semiconductor wafers. It enables precise scribing, cutting and cleaving with smooth edges free of chipping and high processing efficiency. Widely used for chip dicing and optical substrate cutting, it ensures intact finished products and suits mass production of precision components.