Micro-nano Pattern Structure Measurement
Micro 3D White Light Interferometer
Micro 3D White Light Interferometer
WLI-6050 Series

·  Features a 14mm large field of view and combined multiple objectives, enabling both wide-range observation and precision measurement.

·  One-touch automatic leveling and focusing supports long-distance measurement, suitable for deep holes and high-drop inspection.

·  Integrates interferometric analysis and true-color imaging for clear details and intuitive, comprehensive measurement.

·  One-click full-area roughness detection with a wide measuring range, compatible with various workpieces.

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Boasting an extra-large single field of view of 14 mm, it is equipped with a 0.6× lightweight lens and a 4-objective turret. One unit fulfills all requirements for wide-field observation and high-precision measurement.
Boasting an extra-large single field of view of 14 mm, it is equipped with a 0.6× lightweight lens and a 4-objective turret. One unit fulfills all requirements for wide-field observation and high-precision measurement.
Equipped with one-touch automatic tilt leveling and dual closed-loop precision focusing. Easy to operate, it supports continuous measurement up to 100 mm and suits inspection of deep holes with large height differences.
Equipped with one-touch automatic tilt leveling and dual closed-loop precision focusing. Easy to operate, it supports continuous measurement up to 100 mm and suits inspection of deep holes with large height differences.
One-click full-area roughness measurement with a wide measuring range, enabling accurate detection of surface roughness ranging from ultra-smooth mirror surfaces to highly rough additive-manufactured workpieces.
One-click full-area roughness measurement with a wide measuring range, enabling accurate detection of surface roughness ranging from ultra-smooth mirror surfaces to highly rough additive-manufactured workpieces.
Featuring proprietary optical path and layered scanning, it delivers accurate film thickness measurement and detects bottom profiles by penetrating transparent layers.
Featuring proprietary optical path and layered scanning, it delivers accurate film thickness measurement and detects bottom profiles by penetrating transparent layers.
It retains black-and-white interferometric analysis and integrates RGB true-color imaging, restoring the topography and color details of samples for comprehensive measurement and intuitive analysis.
It retains black-and-white interferometric analysis and integrates RGB true-color imaging, restoring the topography and color details of samples for comprehensive measurement and intuitive analysis.
Supports one-click automatic inspection report generation and is compatible with MES systems, enabling seamless upload and synchronization of measurement data.
Supports one-click automatic inspection report generation and is compatible with MES systems, enabling seamless upload and synchronization of measurement data.