Curved Surface R Measurement
Laser Coherent 3D Optical Profiler
Laser Coherent 3D Optical Profiler
Profound Series

·  Coaxial vertical scanning avoids obstructions. With a single frame of 90 mm, it delivers efficient large-field stitching.

·  Supports detection of deep holes up to 130 mm deep with a 30:1 aspect ratio. It achieves one-shot measurement with an accuracy of ±2 mm.

·  The coaxial optical path features superior angular performance for precise measurement of cutting edge radius and angles.

·  Intelligently fits and calculates the radius of curved surfaces to eliminate manual measurement errors.

·  Equipped with a rotary scanning structure to realize 3D profile measurement of inner hole walls.

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Adopting coaxial epi-illumination vertical scanning design, it effectively avoids obstruction interference from samples. The single scanning range reaches 90 mm, enabling efficient seamless stitching for large field of view.
Adopting coaxial epi-illumination vertical scanning design, it effectively avoids obstruction interference from samples. The single scanning range reaches 90 mm, enabling efficient seamless stitching for large field of view.
Supports deep hole detection up to 130 mm with an aspect ratio of 30:1. It delivers repeat accuracy of ±2 μm and enables direct single-scan imaging without Z-axis stitching.
Supports deep hole detection up to 130 mm with an aspect ratio of 30:1. It delivers repeat accuracy of ±2 μm and enables direct single-scan imaging without Z-axis stitching.
The coaxial epi-illumination optics outperforms conventional triangulation imaging, delivering clear imagery for precise measurement of edge rounding R values and flank angles of milling cutters.
The coaxial epi-illumination optics outperforms conventional triangulation imaging, delivering clear imagery for precise measurement of edge rounding R values and flank angles of milling cutters.
Conventional reflective optical paths cannot measure the vertical inner walls of holes. A rotating reflective scanning mechanism enables 3D profile scanning of inner holes.
Conventional reflective optical paths cannot measure the vertical inner walls of holes. A rotating reflective scanning mechanism enables 3D profile scanning of inner holes.
The key challenge for curved surface R measurement lies in automatic curve fitting for radius calculation, which eliminates measurement errors caused by manual picking with a mouse.
The key challenge for curved surface R measurement lies in automatic curve fitting for radius calculation, which eliminates measurement errors caused by manual picking with a mouse.
Fully featured for one-stop geometric tolerance measurement, including dimensions, holes, slots, angles and flatness. With a concise and user-friendly interface, it ensures efficient and convenient measurement.
Fully featured for one-stop geometric tolerance measurement, including dimensions, holes, slots, angles and flatness. With a concise and user-friendly interface, it ensures efficient and convenient measurement.
Triangulation-based 3D Optical Profiler
Triangulation-based 3D Optical Profiler
Delta Series

·  Compatible with workpieces of various materials. No surface treatment is required for efficient and convenient inspection.

·  Delivers sub-micron high precision. Large-field measurement is available without stitching, with optional multiple probes.

·  Adopts layered scanning technology to penetrate the surface and accurately detect internal structural features.

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No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
No powder spraying or surface treatment required for high-reflective and diffuse-reflective workpieces, enabling direct scanning. Specially designed for heat sink fin angle measurement, it completes scanning and outputs results in just one second.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
It breaks the field-of-view limitation for transparent glass inspection. Triangulation scanning achieves submicron-level measurement over a 4 mm field of view in 3 seconds without stitching, with optional probes available on demand.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Enables step height measurement for flexible transparent FPC boards, eliminating inefficiencies from probe contact and image stitching. It delivers submicron accuracy with ultra-fast 3-second scanning, featuring a standard 4 mm field of view and optional multiple probes.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Suitable for grid line inspection on diffuse and light-absorbing photovoltaic wafers. It completes aspect ratio measurement in 2 seconds, and efficiently detects subtle process defects with a large field of view.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Tested with Mitutoyo 516-498 standard step gauges, it can clearly resolve standard steps down to 2 μm.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.
Equipped with a proprietary layered algorithm, it penetrates the top cover glass to accurately scan and analyze the bonding state of the underlying COB image sensor chip, and clearly reconstructs the chip warpage profile.