Deep Hole 3D Profile Measurement
Laser Coherent 3D Optical Profiler
Laser Coherent 3D Optical Profiler
Profound Series

·  Coaxial vertical scanning avoids obstructions. With a single frame of 90 mm, it delivers efficient large-field stitching.

·  Supports detection of deep holes up to 130 mm deep with a 30:1 aspect ratio. It achieves one-shot measurement with an accuracy of ±2 mm.

·  The coaxial optical path features superior angular performance for precise measurement of cutting edge radius and angles.

·  Intelligently fits and calculates the radius of curved surfaces to eliminate manual measurement errors.

·  Equipped with a rotary scanning structure to realize 3D profile measurement of inner hole walls.

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Adopting coaxial epi-illumination vertical scanning design, it effectively avoids obstruction interference from samples. The single scanning range reaches 90 mm, enabling efficient seamless stitching for large field of view.
Adopting coaxial epi-illumination vertical scanning design, it effectively avoids obstruction interference from samples. The single scanning range reaches 90 mm, enabling efficient seamless stitching for large field of view.
Supports deep hole detection up to 130 mm with an aspect ratio of 30:1. It delivers repeat accuracy of ±2 μm and enables direct single-scan imaging without Z-axis stitching.
Supports deep hole detection up to 130 mm with an aspect ratio of 30:1. It delivers repeat accuracy of ±2 μm and enables direct single-scan imaging without Z-axis stitching.
The coaxial epi-illumination optics outperforms conventional triangulation imaging, delivering clear imagery for precise measurement of edge rounding R values and flank angles of milling cutters.
The coaxial epi-illumination optics outperforms conventional triangulation imaging, delivering clear imagery for precise measurement of edge rounding R values and flank angles of milling cutters.
Conventional reflective optical paths cannot measure the vertical inner walls of holes. A rotating reflective scanning mechanism enables 3D profile scanning of inner holes.
Conventional reflective optical paths cannot measure the vertical inner walls of holes. A rotating reflective scanning mechanism enables 3D profile scanning of inner holes.
The key challenge for curved surface R measurement lies in automatic curve fitting for radius calculation, which eliminates measurement errors caused by manual picking with a mouse.
The key challenge for curved surface R measurement lies in automatic curve fitting for radius calculation, which eliminates measurement errors caused by manual picking with a mouse.
Fully featured for one-stop geometric tolerance measurement, including dimensions, holes, slots, angles and flatness. With a concise and user-friendly interface, it ensures efficient and convenient measurement.
Fully featured for one-stop geometric tolerance measurement, including dimensions, holes, slots, angles and flatness. With a concise and user-friendly interface, it ensures efficient and convenient measurement.
Multi-functional Surface Profiling Interferometer
Multi-functional Surface Profiling Interferometer
WLI-4100 Series

·  Nanometer-level accuracy with full-area scanning over a 200×200 mm large field of view.

·  Capable of measuring the parallelism of two sides on workpieces with steps up to 70 mm.

·  Equipped with a spectral module to simultaneously inspect surface profile and roughness.

·  Automatic measurement and intelligent judgment, ideal for full batch inspection.

·  Proprietary optical path enables simultaneous dual-side scanning for accurate thickness and parallelism measurement.

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Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Nanometer Precision | 200×200mm Field of View for Scanning & Imaging
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Limited by optical constraints, traditional interferometers cannot perform simultaneous dual-side scanning on workpieces with 70 mm steps, making it difficult to measure planar parallelism.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Traditional cross-section measurement is prone to sampling offset due to sample variations, resulting in significant data deviations. Planar step measurement can effectively eliminate such errors.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
Restricted by optical limitations, traditional large-area surface measurement struggles to balance XY-axis precision. The integrated spectral module enables accurate roughness measurement while maintaining high precision.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
This nano-precision inspection device features automatic point measurement and intelligent OK/NG judgment, greatly improving efficiency and suiting full inspection for mass production.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.
Adopting a proprietary optical path structure, it enables simultaneous scanning of upper and lower surfaces for non-transparent samples, delivering accurate detection of thickness uniformity and surface parallelism.