In the mass production of QD-LED display devices, inkjet printing serves as the core process for patterning quantum dot (QD) thin films, featuring high precision, low material loss and capability for large-area fabrication. As a key parameter of the inkjet process, ink droplet volume directly determines the thickness and uniformity of QD thin films as well as the color consistency of pixels. It is a critical factor affecting the image quality, color gamut and screen uniformity of display imaging. Deviations in ink droplet volume will lead to uneven pixel brightness, color shift and film defects, greatly reducing the yield of display devices. Therefore, precise control of ink droplet volume is essential for manufacturing high-end display products.
Traditional ink droplet inspection methods such as high-speed imaging and gravimetry can only characterize droplet morphology in two dimensions. They fail to accurately detect picoliter-scale tiny volume errors, and are incompatible with the high viscosity and high volatility of QD ink. Their limited precision and poor real-time performance cannot meet the requirements of advanced display manufacturing processes. Based on non-contact optical interferometry, the optical 3D profiler enables high-precision 3D morphology detection at micro and nano scales. It rapidly acquires 3D profile data of individual QD ink droplets and accurately calculates key parameters including droplet volume, spread area and thickness gradient, eliminating blind spots and precision errors inherent in conventional inspection methods.
For practical process control, real-time sampling and data analysis of ink droplet volume via the optical 3D profiler allow accurate calibration of process parameters such as ejection pressure, ejection frequency and substrate gap of inkjet printheads. This keeps the fluctuation of QD ink droplet volume within permissible process ranges. Stable droplet volume ensures uniform deposition of QD thin films across all pixel units, effectively eliminating color deviation caused by uneven film thickness, and improving the color gamut coverage and color reproduction capability of devices. It fundamentally stabilizes color performance and visual quality of display imaging. In addition, this inspection solution is applicable to QD patterning processes for emerging display products including flexible displays and high-resolution Micro-LEDs, delivering both high precision and excellent adaptability for mass production.
Recrom — Professional Provider of Integrated Optical 3D Measurement Solutions
Large-Field 3D White Light Interferometer – Full-Range Measurement Solution (Industrial & Semiconductor Dedicated)
Breaking the constraints of conventional measurement technologies and establishing a new paradigm for precision measurement. Equipped with core innovative technologies, this large-field 3D white light interferometer delivers nanoscale measurement across all application scenarios. It redefines the efficiency and accuracy of industrial measurement, provides comprehensive technical support for the inspection of semiconductors, optical components and various precision parts, and fully meets stringent measurement requirements in multiple industries.
Four Core Technological Innovations (Industrial Grade, Optimized for Semiconductor Applications)
I. Large Field of View Combined with High Precision, Outperforming Industry Norms
This instrument overcomes the drawbacks of traditional equipment. Objective lenses below 1× are suitable for diverse scenarios, enabling both wide-field observation and high-precision measurement on a single device. Fitted with a new lightweight 0.6× lens, it features an ultra-large single frame field of view of 14 mm. Supported by a turret design compatible with four objective lenses, it fully satisfies the demands for large-area viewing and high-accuracy measurement. Ideal for inspecting various complex samples, it avoids frequent device switching and greatly boosts inspection efficiency and data accuracy.
(The above is the measured flatness of a 14 mm end face. Accurate control of component flatness provides a reliable foundation for subsequent measurements of semiconductor devices and precision optical components.)
(Measured data: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) and meets the ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
II. 80° Inclined Measurement, Breaking Planar Measurement Limitations
It overturns the conventional belief that white light interferometry is only applicable to flat surfaces. Adopting advanced high-angle measurement technology, it effortlessly measures steep inclined planes and conical surfaces up to 80° with excellent compatibility. A single device supports full-scenario measurement without additional dedicated instruments, further expanding its application scope. It is well suited for inspecting irregularly shaped components in semiconductor packaging, precision machining and other fields.
III. True-Color 3D Measurement, Delivering an All-New Experience
Surpassing industrial technical bottlenecks, this instrument retains the capability of monochrome CMOS to resolve interference fringes and enables RGB true color imaging, overcoming the limitation of conventional white light interferometers that only produce monochrome images. It clearly displays sample morphology and color details, delivering comprehensive measurement data and intuitive analysis with high reference value, and is ideal for sophisticated applications such as surface defect detection of semiconductor devices.
IV. Upper & Lower Surface Parallelism Measurement for Diverse Application Scenarios
With a proprietary optical path design, this instrument can measure the thickness and parallelism of upper and lower surfaces of opaque workpieces. It caters to the measurement requirements of various opaque precision parts and multi-layer semiconductor devices. It expands application coverage, enhances measurement versatility and cuts down the cost of purchasing multiple devices.
Friction Surface Characterization Cases (Exclusive for Industrial and Semiconductor Industries)
Comparative friction tests of different lubricants
Measure scratch depth and wear area of friction surfaces to visually distinguish lubrication performance. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission components of semiconductor devices.
Friction surface measurement of curved rollers
Direct quantitative measurement cannot be performed on original curved roller surfaces. After surface flattening treatment, wear amount can be accurately measured and evaluated. It is applicable to quality inspection of mechanical transmission parts and rollers for semiconductor equipment.
Friction surface characterization after laser drilling
Conduct texture detection on friction surfaces after laser drilling. It accurately analyzes the influence of process parameters on the roughness and flatness of friction surfaces, and applies to semiconductor packaging, precision machining and other fields.
Roughness measurement on friction surfaces of automotive and semiconductor components
Achieve precise detection of roughness (Ra/Rz) for automotive friction parts and contact surfaces of semiconductor devices. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.