In the semiconductor manufacturing of QLED and Micro-LED displays, quantum dot inkjet printing serves as the core process for forming color pixel arrays. Pixel forming precision and single-drop ink volume consistency directly determine the luminous uniformity, color gamut stability and production yield of devices. During inkjet printing, ink viscosity, surface tension and substrate wettability often lead to uneven droplet spreading and material accumulation. Minor ink volume errors may cause defects such as inconsistent pixel film thickness and the coffee ring effect, which compromise the product quality of high-end display panels. Accordingly, high-precision non-contact in-line inspection technology has become essential for process control.
Based on white light interferometry, the optical 3D profiler features nanoscale vertical resolution and submicron lateral detection capability. It overcomes the drawbacks of atomic force microscopy (AFM), including low testing efficiency and potential film damage caused by contact measurement, fully meeting the high-precision inspection requirements of quantum dot inkjet processes. Equipped with interference optical paths, the instrument acquires 3D morphology data of pixel areas, and accurately measures key parameters such as solidified film thickness, profile flatness and pixel boundary dimensions. It enables quantitative analysis of single-drop ink volume and integrates high-precision inspection for both pixel forming accuracy and ink volume.
In routine semiconductor inspection, the device performs full-area scanning on solidified quantum dot pixel units to accurately identify process anomalies including pixel deformation, abnormal ink dosage and uneven local film thickness. With big data fitting algorithms, 3D morphological parameters are converted into accurate ink volume values to calibrate the ejection parameters of inkjet printheads in real time. This effectively reduces pixel forming deviations and ensures excellent consistency in pixel size, film thickness and ink volume across the entire array. Compared with conventional 2D optical inspection, the optical 3D profiler breaks the limitations of planar detection, reconstructs the microscopic 3D structure of pixels, and covers all key precision control points of inkjet processes. It is well suited for mass inspection of fine-pitch and high-resolution display pixels.
This high-precision inspection solution effectively addresses industrial challenges including difficult precision control and poor ink volume consistency in quantum dot inkjet processes, and steadily improves pixel forming quality. It provides core technical support for the refined and large-scale production of semiconductor display devices.
Recrom — Professional Provider of Integrated Optical 3D Measurement Solutions
Large-Field 3D White Light Interferometer – Full-Spectrum Measurement Solution (Industrial & Semiconductor-Specific)
Breaking the limitations of conventional measurement technologies and setting a new benchmark for precision measurement. Powered by core innovative technologies, this large-field 3D white light interferometer delivers nanoscale measurement for all application scenarios. It redefines the efficiency and accuracy of industrial measurement, provides comprehensive technical support for the inspection of semiconductors, optical components and diverse precision parts, and satisfies stringent measurement requirements across multiple industries.
Four Core Technological Innovations (Industrial Grade, Optimized for Semiconductor Applications)
I. Large Field of View & High Precision, Transcending Industry Norms
It overcomes the shortcomings of traditional equipment. Objective lenses below 1× are applicable to multiple scenarios, enabling wide-field observation and high-precision measurement with a single unit instead of separate devices. Equipped with a newly developed lightweight 0.6× lens, it features an ultra-large single frame field of view of 14 mm. Combined with a turret design compatible with four objective lenses, the instrument fully meets the demands for large-area viewing and high-accuracy measurement. Suitable for inspecting various complex samples, it eliminates frequent device switching and greatly improves inspection efficiency and data accuracy.
(The above shows the measured flatness of a 14 mm end face. Precise control of component planarity lays a solid foundation for subsequent measurements of semiconductor devices and precision optical components.)
(Measured data: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) and fulfills ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
II. 80° Inclined Measurement, Breaking Planar Measurement Barriers
It challenges the long-standing industry perception that white light interferometry is limited to flat surfaces. Adopting advanced high-angle measurement technology, it easily measures steep inclined planes and conical surfaces up to 80° with outstanding compatibility. A single unit handles full-scenario measurement without additional dedicated instruments, further expanding its application scope. It is ideal for inspecting irregular components used in semiconductor packaging, precision machining and other fields.
III. True-Color 3D Measurement for an Enhanced Experience
Surpassing industrial technical bottlenecks, this instrument retains the capability of monochrome CMOS to resolve interference fringes and supports RGB true color imaging, overcoming the limitation of conventional white light interferometers that only produce grayscale images. It clearly visualizes sample morphology and color details, delivering comprehensive measurement data and intuitive analysis with high reference value. It is well-suited for sophisticated applications such as surface defect detection of semiconductor devices.
IV. Upper and Lower Surface Parallelism Measurement for Versatile Applications
Featuring a proprietary optical path design, the system measures the thickness and upper-lower surface parallelism of opaque workpieces. It meets measurement requirements for various opaque precision parts and multi-layer semiconductor devices, expands application scenarios, improves measurement versatility and cuts costs for purchasing multiple devices.
Friction Surface Characterization Cases (Exclusive for Industrial and Semiconductor Industries)
Comparative friction tests of different lubricants
Measure the scratch depth and wear area of friction surfaces to visually distinguish lubrication performance. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission components of semiconductor devices.
Friction surface measurement of curved rollers
Direct quantitative measurement is not feasible for original curved roller surfaces. After surface flattening treatment, wear amount can be accurately measured and evaluated. It applies to quality inspection of mechanical transmission components and rollers for semiconductor equipment.
Friction surface characterization after laser drilling
Perform texture detection on friction surfaces after laser drilling. It accurately analyzes the impact of process parameters on the roughness and flatness of friction surfaces, serving semiconductor packaging, precision machining and other fields.
Roughness measurement of friction surfaces for automotive and semiconductor components
Achieve precise detection of roughness (Ra/Rz) on automotive friction parts and contact surfaces of semiconductor devices. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.