In the inkjet process for high-end quantum dot displays, inkjet process precision acts as a core factor restricting the consistency of pixel formation and color performance of images. As a critical parameter of the inkjet process, micro droplet volume directly determines the film thickness on substrates, pixel color accuracy and luminous uniformity in terms of its numerical stability and uniformity. Even minor deviations in micro droplet volume are highly likely to cause process defects such as pixel chromatic aberration, uneven film thickness, local over-bright areas and dark spots, which severely impair the overall quality and production yield of display panels. Therefore, high-precision detection and standardized control of micro droplet volume constitute a core part of refined inkjet process management.
Quantum dot ink contains nano-scale optoelectronic functional particles and presents unique rheological properties. Its dynamic viscosity and surface tension are susceptible to inkjet drive waveforms, ambient temperature and humidity, as well as printhead conditions. This frequently leads to abnormal operating conditions during mass production, including discrete micro droplet volumes, satellite droplets, interrupted ink ejection and deformed droplets. Traditional weighing methods and two-dimensional optical imaging feature low resolution, failing to accurately identify picoliter-scale micro-volume deviations. Their considerable detection errors make them incapable of meeting the high-precision quality control requirements for micro-nano scale inkjet processes.
Based on the high-precision white light interference principle, the White Light Interferometer (WLI) enables non-contact and non-destructive detection of micro-scale morphology and volume. By acquiring the 3D micro-morphology of droplets deposited on the substrate and adopting interference fringe analysis and 3D reconstruction algorithms, the instrument accurately calculates key process parameters including micro droplet volume, local film thickness and profile roughness. It efficiently captures minor volume deviations and forming defects undetectable by conventional methods. With nanometer-level detection accuracy, it realizes precise calibration and data traceability of process parameters.
In practical production management, the white light interferometer can be applied to routine detection and parameter calibration of micro droplet volumes for RGB three-color quantum dot inkjet. A standardized process threshold system can be established to collaboratively optimize core parameters such as inkjet driving voltage and ejection frequency, so as to build a high-precision closed-loop quality control system. By pinpointing deviations in micro droplet volume, the inkjet process precision is continuously optimized, effectively reducing process defect rates, stabilizing the forming quality of quantum dot pixels, and comprehensively improving the color consistency and mass production stability of display panels. Recrom provides professional and integrated optical 3D measurement solutions.
To sum up, the coaxial design of laser welding optical path and detection laser is one of the key technologies for real-time monitoring of welding keyholes. With continuous design optimization and technological improvement, it is expected to play an increasingly important role in industrial manufacturing in the future.
Wide-Field 3D White Light Interferometer – Full-Range Measurement Solution (Dedicated for Industry & Semiconductors)
Break the limitations of conventional measurement and set a new paradigm for precision measurement. Powered by core innovative technologies, the wide-field 3D white light interferometer delivers nanoscale measurement across all scenarios. Featuring high efficiency and superior accuracy, it redefines the standards of industrial measurement. It provides comprehensive technical support for the inspection of semiconductors, optical components and various precision parts, and meets stringent measurement requirements across diverse fields.
Four Core Technological Innovations (Industrial Grade, Optimized for Semiconductor Applications)
1. Wide Field of View & High Precision, Redefining Industry Norms
Breaking the limitations of traditional equipment, objective lenses with magnification below 1× support versatile application scenarios. The system integrates wide-field observation and high-precision measurement on a single device, eliminating the need for separate instruments.
Equipped with a brand-new lightweight 0.6× lens, it delivers an ultra-large single frame field of view of 14 mm. Combined with a turret design compatible with four objective lenses, one unit fully addresses both wide-field observation and high-precision measurement requirements. It adapts to the inspection of various complex samples, reduces frequent equipment switching, and greatly improves inspection efficiency and data accuracy.
(The above result is the measured flatness of a 14 mm end face. It enables precise control of component planar accuracy and lays a solid foundation for subsequent measurements of semiconductor devices and precision optical components.)
(Measured data as above: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) and meets the ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
2. 80° Tilt Measurement, Breaking Planar Measurement Limitations
Challenging the conventional belief that white light interferometry is only applicable to planar surfaces, our advanced high-angle measurement technology enables reliable detection on steep inclined planes and conical surfaces up to 80°, delivering excellent compatibility. A single device fulfills full-scenario measurement needs without additional dedicated instruments. It further expands the scope of application and suits the inspection of irregular components in semiconductor packaging, precision machining and other fields.
3. True-color 3D Measurement for an All-new Experience
Breaking through technical bottlenecks in the industry, this system retains the capability to analyze interference fringes via monochrome CMOS while enabling RGB true-color imaging. It overcomes the limitation that conventional white light interferometers can only produce monochrome images. The solution clearly displays sample morphology and color details, delivering more comprehensive measurement information and intuitive analysis, thus enhancing the reference value of data. It is well-suited for sophisticated applications such as surface defect detection of semiconductor devices.
4. Upper and Lower Plane Parallelism Measurement for Versatile Applications
Featuring a unique optical path design, the instrument can measure the thickness and upper-lower plane parallelism of opaque workpieces. It caters to the measurement requirements of various opaque precision parts and multi-layer structured semiconductor devices. This further broadens application scenarios, improves equipment versatility and cuts down costs on multiple instrument investments.
Friction Surface Characterization Measurement Cases (For Industrial & Semiconductor Fields)
Comparative friction tests of different lubricants: Measure scratch depth and wear area of friction surfaces to visually distinguish the lubrication performance of various lubricants. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission components of semiconductor devices.
Friction surface measurement of curved rollers: Traditional methods fail to quantify measurement results for original curved roller surfaces. After surface flattening treatment, accurate measurement and evaluation of wear amount can be realized. This solution applies to quality inspection of mechanical transmission components and rollers for semiconductor equipment.
Friction surface characterization after laser drilling: Conduct texture detection on friction surfaces processed by laser drilling. It accurately analyzes the influence of process parameters on surface roughness and flatness, serving semiconductor packaging, precision machining and other industries.
Roughness measurement for friction surfaces of automotive parts and semiconductor devices: Achieve precise detection of roughness (Ra/Rz) on friction parts of automobiles and contact surfaces of semiconductor components. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.