Perovskite Solar Cells (PSC) have emerged as a core development direction for a new generation of photovoltaic devices, thanks to their high photoelectric conversion efficiency and low-cost manufacturing processes. In the mass production of perovskite cell modules, the structured etching process for P1/P2/P3 grooves serves as a critical procedure for cell series integration and electrical isolation. The depth uniformity and dimensional accuracy of the grooves directly determine the series resistance matching and interfacial recombination characteristics of modules. Irregular groove depth is highly likely to cause electric leakage, increased series loss and film layer damage, which drastically reduce photoelectric conversion efficiency. This has become a major technical bottleneck restricting the production stability and yield of perovskite modules. Traditional inspection methods such as microscopic observation and laser ranging suffer from insufficient resolution, failing to achieve precise quantitative measurement of micro-nano groove depth and meet the quality control requirements of precision manufacturing.
To realize refined control of the perovskite grooving process, this work adopts the optical 3D non-destructive testing technology based on White Light Interferometer (WLI) to establish a high-precision quality control system tailored for the P1/P2/P3 grooving process. It enables accurate control of groove forming depth, profile and edge flatness, so as to stabilize the photoelectric conversion performance of devices. Compliant with the SOP standards for mass production in the photovoltaic and semiconductor industries, the complete inspection workflow includes sample alignment and calibration, full-area 3D scanning, topography data reconstruction, depth parameter fitting and process deviation analysis, which is well suited for high-speed batch inspection on production lines.
Equipped with dual detection modes of Vertical Scanning Interferometry (VSI) and Phase Shifting Interferometry (PSI), the instrument delivers nanometer-level vertical measurement accuracy. It can acquire the 3D micro-morphology of P1/P2/P3 grooves in a non-destructive manner and quantitatively characterize key parameters including groove depth, groove width, sidewall roughness and bottom flatness. Unlike contact-type measuring devices that tend to scratch ultra-thin functional films of perovskite, the white light interferometer adopts a non-contact scanning mode to fully preserve the integrity of thin films. Meanwhile, it accurately identifies latent process defects such as over-etching, under-etching and profile distortion, enabling full-dimensional quality monitoring of the grooving process.
The system collects and analyzes production inspection data in real time, calculates quality control indicators including groove depth deviation and defect distribution rate, and accurately reflects fluctuations in process parameters such as laser etching power, scanning speed and focal position. It provides quantitative data support for parameter optimization and closed-loop process control of perovskite P1/P2/P3 grooving. This effectively reduces interfacial recombination loss and abnormal series resistance, and maintains consistent and stable photoelectric conversion efficiency of devices in long-term production.
Recrom — Professional Provider of Integrated Optical 3D Measurement Solutions
Large Field-of-View 3D White Light Interferometer – Full-Area Measurement Solution (For Industrial & Semiconductor Applications)
Breaking the limitations of conventional measurement technologies and setting a new paradigm for precision measurement. Featuring core innovative technologies, this large field-of-view 3D white light interferometer delivers nanoscale measurement across diverse scenarios. Combining high efficiency and superior accuracy, it redefines the standards of industrial metrology. It provides comprehensive technical support for the inspection of semiconductors, optical components and various precision parts, fully meeting stringent measurement requirements across multiple industries.
Four Core Technological Innovations (Industrial Grade, Optimized for Semiconductor Applications)
I. Large Field of View Combined with High Precision, Breaking Industry Conventions
Surpassing the limitations of traditional equipment, it supports a wide range of applications with objective lenses below 1×, enabling both large-field observation and high-precision measurement on a single unit. Equipped with a brand-new lightweight 0.6× lens, it features an ultra-large single frame field of view of 14 mm. Paired with a turret design compatible with four objective lenses, the system fully meets demands for large-field observation and high-precision measurement. It adapts to inspection of various complex samples, eliminating frequent equipment switching and greatly improving inspection efficiency and data accuracy.
(The above result is the measured flatness of a 14 mm end face. Accurate control of component flatness lays a solid foundation for subsequent measurement of semiconductor devices and precision optical components.)
(Measured data: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) to satisfy ultra-precision measurement requirements for semiconductor chips and high-precision components.)
II. 80° Inclined Measurement, Breaking Planar Measurement Limitations
Challenging the conventional belief that white light interferometry only applies to flat surfaces, it adopts advanced high-angle measurement technology to effectively measure steep inclined planes and conical surfaces up to 80° with excellent compatibility. A single unit fulfills full-scenario measurement needs without additional dedicated instruments. It further expands the application scope and supports inspection of special-shaped components in semiconductor packaging, precision machining and other fields.
III. True-Color 3D Measurement for an Enhanced Experience
Breaking through industrial technical bottlenecks, the system retains the capability to analyze interference fringes via monochrome CMOS and realizes RGB true color imaging. It overcomes the drawback of traditional white light interferometers that only produce monochrome images.
It clearly displays sample morphology and color details, delivering more comprehensive measurement data and enabling more intuitive analysis with higher reference value. This function is well suited for sophisticated applications such as surface defect detection of semiconductor devices.
IV. Upper and Lower Surface Parallelism Measurement for Versatile Applications
With a unique optical path design, the system can measure the thickness and upper/lower surface parallelism of opaque workpieces. It meets the measurement requirements of various opaque precision parts and multi-layer semiconductor devices. This further broadens the application range, improves measurement versatility and cuts the cost of purchasing multiple pieces of equipment.
Friction Surface Characterization Measurement Cases (Exclusive for Industrial and Semiconductor Industries)
Comparative friction tests of different lubricantsMeasure the scratch depth and wear area of friction surfaces to visually identify differences in lubrication performance. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission parts of semiconductor devices.
Friction surface measurement of curved rollersDirect quantitative measurement is unfeasible for original friction surfaces of curved rollers. After surface flattening treatment, wear amount can be accurately measured and evaluated. This solution applies to quality inspection of mechanical transmission components and rollers for semiconductor equipment.
Friction surface characterization after laser drillingConduct texture detection on friction test surfaces after laser drilling. It accurately analyzes the impact of process parameters on the roughness and flatness of friction surfaces, serving semiconductor packaging, precision machining and other fields.
Roughness measurement for friction surfaces of automotive and semiconductor componentsAchieve precise detection of roughness (Ra/Rz) on automotive friction parts and contact friction surfaces of semiconductor devices. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.