In the industrialization of Quantum Dot Light-Emitting Diode (QLED) display devices, the optical color accuracy of RGB quantum dot luminescence and the process stability of inkjet printing are core factors determining the color gamut performance and production yield of devices. In conventional fabrication processes, quantum dot materials feature dense surface defect states, large full width at half maximum (FWHM) of emission spectra and color coordinate shift. These issues tend to narrow the display color gamut and degrade color reproduction capability, failing to meet the optical specifications for high-end displays. Meanwhile, inconsistent inkjet droplet volume leads to uneven thickness of quantum dot films and poor uniformity of luminescent layers, which directly impairs the optical performance stability and regulatory compliance of devices.
To address the optical color deviation of RGB quantum dot luminescence, this work optimizes performance via surface ligand passivation and particle size homogenization regulation. Modification of organic ligands on quantum dot surfaces effectively passivates non-radiative recombination defects and reduces luminescence loss. Precise regulation of particle size distribution for red, green and blue quantum dots narrows the FWHM of emission spectra, improving monochromatic light purity and color gamut coverage. In addition, the thickness of electron transport layers (ETL) and hole transport layers (HTL) is optimized to balance carrier injection efficiency and enhance luminance uniformity of RGB emission. This solves common industrial problems such as color shift and color gradient distortion, and greatly improves overall optical color accuracy.
Precise control of inkjet droplet volume is critical to ensure compliance in quantum dot film fabrication during inkjet printing. Traditional inspection methods suffer from limited accuracy and cannot detect volume deviations of microscale droplets. This paper adopts three-dimensional inspection technology based on White Light Interferometer (WLI). Leveraging its superior micrometer-level imaging accuracy, the system conducts full-area verification on the forming state, volume parameters and spreading morphology of inkjet droplets. It accurately collects key data including single droplet volume, ejection consistency and forming defects. In line with manufacturing compliance standards of the display industry, it corrects parameter deviations of inkjet equipment and prevents quality issues such as uneven film thickness, dark luminescent spots and color difference caused by abnormal droplet volume.
This optimization solution achieves dual improvements in the color rendering performance of RGB quantum dot luminescence and the precision of inkjet printing processes. Optical structure optimization consolidates the foundation for superior color performance, while high-precision inspection standardizes manufacturing procedures, delivering solid technical support for the large-scale mass production of QLED devices.
Recrom — Professional provider of integrated optical 3D measurement solutions
Large-Field 3D White Light Interferometer – Full-Scale Measurement Solution (Industrial & Semiconductor Dedicated)
Breaking the limitations of conventional measurement techniques and setting a new benchmark for precision measurement. Equipped with core innovative technologies, this large-field 3D white light interferometer delivers nanoscale measurement for all application scenarios. It redefines the efficiency and accuracy of industrial measurement with outstanding performance, providing comprehensive technical support for the inspection of semiconductors, optical elements and various precision components, and fully meeting stringent measurement requirements across multiple industries.
Four Core Technological Innovations (Industrial Grade, Tailored for Semiconductor Applications)
I. Large Field of View Combined with High Precision, Breaking Industry Conventions
This instrument overcomes the drawbacks of traditional equipment. Objective lenses below 1× are applicable to diverse scenarios, enabling large-field observation and high-precision measurement with a single device. Fitted with a newly developed lightweight 0.6× lens, it boasts an ultra-large single frame field of view of 14 mm. Supported by a turret design compatible with four objective lenses, it fully meets dual demands for wide-range viewing and high-accuracy measurement. Suitable for inspecting various complex samples, it eliminates frequent device switching and significantly improves inspection efficiency and data accuracy.
(The above is the measured flatness of a 14 mm end face. Accurate control of component flatness provides a reliable basis for subsequent measurement of semiconductor devices and precision optical components.)
(Measured data: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) to fulfill ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
II. 80° Inclined Measurement, Breaking Planar Measurement Barriers
Defying the industry stereotype that white light interferometry only works for flat surfaces, it adopts advanced high-angle measurement technology to measure steep inclined planes and conical surfaces up to 80° with excellent compatibility. A single unit supports full-scenario measurement without additional dedicated instruments, expanding the application scope. It is ideal for inspecting special-shaped components in semiconductor packaging, precision machining and other sectors.
III. True-Color 3D Measurement for an Enhanced Experience
Breaking key technical barriers in the industry, the instrument retains the monochrome CMOS capability for interference fringe analysis while enabling RGB true color imaging. It eliminates the limitation of conventional white light interferometers that only output grayscale images.
It clearly visualizes sample morphology and color details, delivering more comprehensive measurement data and more intuitive analysis with higher reference value. It is well suited for sophisticated applications such as surface defect detection of semiconductor devices.
IV. Upper and Lower Surface Parallelism Measurement for Diverse Application Scenarios
Featuring a proprietary optical path design, the instrument can measure the thickness and upper-to-lower surface parallelism of opaque workpieces. It caters to the measurement needs of various opaque precision parts and multi-layer semiconductor devices. This further diversifies applicable scenarios, improves measurement versatility and cuts down costs for purchasing multiple pieces of equipment.
Friction Surface Characterization Cases (For Industrial and Semiconductor Fields)
Comparative friction tests of different lubricants
Measure the scratch depth and wear area of friction surfaces to visually distinguish lubrication performance. It provides data reference for optimizing lubrication systems of industrial equipment and maintaining transmission parts of semiconductor devices.
Friction surface measurement of curved rollers
Direct quantitative measurement cannot be performed on the original friction surfaces of curved rollers. After surface flattening treatment, the wear amount can be accurately measured and evaluated. This solution applies to quality inspection of mechanical transmission components and rollers for semiconductor equipment.
Friction surface characterization after laser drilling
Conduct texture detection on friction test surfaces after laser drilling. It accurately analyzes how process parameters affect the roughness and flatness of friction surfaces, and is applicable to semiconductor packaging, precision machining and other fields.
Roughness measurement of friction surfaces for automotive and semiconductor components
Realize precise detection of roughness (Ra/Rz) on automotive friction parts and contact surfaces of semiconductor devices. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.