In the mass production of photovoltaic devices, the laser scribing process serves as a core procedure for the structural fabrication of thin-film solar cells and crystalline silicon photovoltaic modules. The consistency and accuracy of laser scribing depth directly affect the electrical conduction performance and edge insulation characteristics of solar cells. Meanwhile, film layering, a common defect in thin-film photovoltaic manufacturing, tends to cause module delamination, electric leakage and accelerated performance degradation, which has become a major bottleneck restricting the improvement of production yield. Conventional detection methods such as optical ranging and microscopic observation are limited in accuracy. They fail to capture micron-scale depth deviations and micro delamination defects, and thus cannot meet the high-precision quality control requirements for photovoltaic mass production.
To address the pain points in photovoltaic process inspection, this paper introduces the optical 3D detection technology based on White Light Interferometer (WLI) and establishes a high-precision inspection system tailored for photovoltaic mass production. The system is dedicated to the quantitative measurement of laser scribing depth and screening of film layering defects, complying with the standards for large-scale and high-precision production of solar cells. The entire inspection workflow conforms to the SOP specifications for photovoltaic and semiconductor manufacturing, covering core modules including sample positioning, full-area scanning, 3D topography reconstruction, depth parameter calibration and delamination defect identification, and is applicable to routine rapid on-line inspection.
Adopting dual-mode detection principles of Phase Shifting Interferometry (PSI) and Vertical Scanning Interferometry (VSI), the white light interferometer delivers nanometer-level vertical measurement accuracy and superior topography resolution. It acquires 3D profile data of laser scribing areas in a non-destructive manner, and accurately quantifies key process parameters including scribing depth, groove width and edge roughness. Unlike contact profilometers, which may scratch photovoltaic thin films and feature low testing efficiency, this instrument enables non-contact high-speed scanning and effectively protects the structural integrity of thin-film layers. For film layering defects, the system accurately identifies latent defects such as micro delamination and interlayer separation by comparing the height difference of interface topography and interlayer gaps, making up for the deficiency of traditional methods in detecting subtle layering flaws.
This inspection system supports synchronous data collection and analysis for production batches. It statistically monitors core quality control indicators in real time, including depth deviation of laser scribing, defect distribution density and film layering failure rate. It accurately reflects process fluctuations in laser power, scanning speed and focal length, providing quantitative reference for the optimization of laser scribing processes and the control of thin-film lamination procedures. It rigorously controls the production yield of photovoltaic products at the inspection stage and satisfies the precision manufacturing demands of high-end photovoltaic devices.
Recrom Optics specializes in providing comprehensive optical 3D measurement solutions
Large-Field 3D White Light Interferometer - Global Measurement Solution (Specifically for Industrial and Semiconductor Applications)
Break the shackles of traditional measurement and set a new paradigm for precision measurement. Equipped with core innovative technologies, the wide-field 3D white light interferometer enables nanoscale measurement for all application scenarios. Combining high efficiency and exceptional accuracy, it redefines the benchmarks of industrial measurement. It delivers comprehensive technical support for the inspection of semiconductors, optical elements and various precision components, fully complying with stringent measurement requirements across multiple industries.
Four Core Technological Innovations (Industrial Grade, Optimized for Semiconductor Applications)
1. Wide Field of View Combined with High Precision, Breaking Industry Conventions
This solution overcomes the limitations of traditional equipment. Lenses with magnification below 1× suit diverse scenarios, integrating wide-field observation and high-precision measurement on a single unit without separate devices.
Fitted with a brand-new lightweight 0.6× objective lens, it features an ultra-large single frame field of view of 14 mm. Supported by a turret design holding up to four objective lenses, one instrument fully meets the demands for wide-field viewing and high-precision measurement. It adapts to the inspection of various complex samples, eliminates frequent equipment switching, and greatly boosts inspection efficiency and data accuracy.
(The above shows the measured flatness of a 14 mm end face. It ensures precise planar accuracy of components and provides a solid foundation for subsequent measurements of semiconductor devices and precision optical parts.)
(Measured data above: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) and fulfills the ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
2. 80° Tilt Measurement, Breaking Planar Measurement Limitations
Defying the industry stereotype that white light interferometry is only applicable to planar surfaces, our advanced high-angle measurement technology delivers reliable results on steep inclined planes and conical surfaces up to 80° with excellent compatibility. A single device handles full-scenario measurement without extra dedicated instruments. It further expands the application scope and is ideal for inspecting irregular components in semiconductor packaging, precision machining and other sectors.
3. True-color 3D Measurement, Delivering an Innovative User Experience
Breaking industry technical barriers, this system retains the interference fringe analysis capability of monochrome CMOS while enabling RGB true-color imaging, overcoming the limitation of conventional white light interferometers that only produce monochrome visuals. It clearly displays sample morphology and color details, providing comprehensive measurement data and intuitive analysis with high reference value. It is well suited for sophisticated applications such as surface defect detection of semiconductor devices.
4. Upper & Lower Plane Parallelism Measurement for Diverse Application Scenarios
With a proprietary optical path design, the instrument can measure the thickness and upper-lower plane parallelism of opaque workpieces. It meets the measurement requirements of various opaque precision parts and multi-layer semiconductor devices. This further extends application coverage, enhances measurement versatility and reduces costs for purchasing multiple pieces of equipment.
Friction Surface Characterization Cases (Industrial & Semiconductor Applications)
Comparative friction tests of different lubricants: Measure scratch depth and wear area on friction surfaces to visually identify differences in lubrication performance. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission components of semiconductor devices.
Friction surface measurement of curved rollers: Traditional methods fail to quantify the friction surfaces of original curved rollers. After surface flattening processing, wear amount can be accurately measured and evaluated. It is applicable to quality inspection of mechanical transmission parts and rollers for semiconductor equipment.
Friction surface characterization after laser drilling: Perform texture detection on friction surfaces after laser drilling, and accurately analyze the impact of process parameters on surface roughness and flatness. It serves applications including semiconductor packaging and precision machining.
Roughness measurement for friction surfaces of automotive and semiconductor components: Achieve precise detection of roughness (Ra/Rz) on automotive friction parts and contact surfaces of semiconductor devices. It delivers reliable data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.