Coaxial Design of Laser Welding Beam and Detection Beam for Real-Time Keyhole Monitoring
The coaxial design of laser welding beam and detection beam to realize real-time keyhole monitoring during welding is a sophisticated yet critical technology. Below is a detailed introduction to this technology.
I. Optical Design for Laser Welding
The optical path of a laser welding system consists of internal optical path (inside the laser source) and external optical path. The internal optical path is manufactured to stringent specifications and generally operates stably on site. The external optical path comprises delivery fiber, QBH connector, welding head and other components, among which the welding head requires regular maintenance.
The laser QBH connector is an optical component widely used in laser cutting, welding and other processes. It mainly guides the laser beam from the optical fiber into the welding head. The collimating and focusing welding head is the core part of the welding unit, which is normally equipped with collimating lenses and focusing lenses. The collimating lens converts divergent light emitted from the optical fiber into parallel light, while the focusing lens converges the parallel light to complete laser welding.
II. Coaxial Design of Detection Laser Beam
To monitor welding keyholes in real time, the detection laser beam is combined coaxially with the welding laser beam. This is commonly achieved by integrating one or more detectors inside the welding head. The detectors capture various signals generated during welding, including optical, acoustic and thermal signals.
The core of the coaxial beam design is to align the optical paths of the detection laser and welding laser, so as to acquire accurate information of the welding keyhole. This relies on high-precision optical components and professional calibration technologies.
III. Implementation of Real-Time Monitoring
Signal AcquisitionDetectors capture images, acoustic signals and other data from the welding keyhole, which are then converted into electrical signals for transmission and processing.
Signal ProcessingThe acquired signals undergo filtering, amplification, digitization and other procedures to facilitate subsequent analysis and identification.
Feature ExtractionImage processing algorithms, machine learning and other technologies are adopted to extract characteristic information related to the welding keyhole from processed signals.
Real-Time MonitoringThe status of the welding keyhole is monitored and evaluated in real time based on the extracted features. Once abnormalities such as insufficient keyhole depth or unstable molten pool are detected, the system will trigger an alarm immediately and perform corresponding adjustments.
IV. Applications and Challenges
Real-time monitoring of laser welding keyholes boasts broad application prospects in aerospace, automotive manufacturing, microelectronics and other industries. It enables engineers to track welding quality dynamically and troubleshoot potential issues in a timely manner, so as to enhance product reliability and safety.
Nevertheless, the implementation of this technology still faces multiple challenges. Intense interference signals generated during welding may compromise detection accuracy. In addition, the complexity and high cost of multi-sensor fusion technology also hinder its large-scale practical deployment. Further research and development of more advanced, robust detection technologies and algorithms are therefore required to address these difficulties.
To conclude, the coaxial design of laser welding beam and detection beam serves as a core technology for real-time keyhole monitoring. With continuous design optimization and technological advancement, it is expected to play an increasingly vital role in industrial manufacturing in the future.
Large-Field 3D White Light Interferometer – Full-Scale Measurement Solution (Industrial & Semiconductor Dedicated)
Breaking the limitations of conventional measurement techniques and setting a new benchmark for precision measurement. Equipped with core innovative technologies, this large-field 3D white light interferometer delivers nanoscale measurement for all working scenarios. It redefines the efficiency and accuracy of industrial measurement, provides comprehensive technical support for the inspection of semiconductors, optical components and various precision parts, and fully complies with stringent measurement requirements across multiple industries.
Four Core Technological Innovations (Industrial Grade, Tailored for Semiconductor Scenarios)
I. Large Field of View & High Precision, Breaking Industry Conventions
This instrument overcomes the limitations of traditional equipment. Objective lenses below 1× are applicable to diverse scenarios, enabling wide-field observation and high-precision measurement with a single device. It is equipped with a newly developed lightweight 0.6× lens, delivering an ultra-large single frame field of view of 14 mm. Combined with a turret design compatible with four objective lenses, it fully meets the requirements for large-area viewing and high-accuracy measurement. Ideal for testing various complex samples, it eliminates frequent equipment switching and significantly improves inspection efficiency and data accuracy.
(The above presents the measured flatness of a 14 mm end face. Precise control of component flatness provides a solid foundation for subsequent measurement of semiconductor devices and precision optical components.)
(Measured data: 6 pm = 0.006 nm. It accurately characterizes surface roughness (Ra/Rz) to meet the ultra-precision measurement requirements for semiconductor chips and ultra-precision components.)
II. 80° Inclined Measurement, Breaking Planar Measurement Restrictions
It breaks the industry stereotype that white light interferometry is only for flat surfaces. Adopting advanced high-angle measurement technology, it can reliably measure steep inclined planes and conical surfaces up to 80° with excellent compatibility. A single unit handles full-scenario measurement without additional dedicated instruments, further expanding its application scope. It is well suited for inspecting irregular components in semiconductor packaging, precision machining and other fields.
III. True-Color 3D Measurement for a Brand-New Experience
Breaking industrial technical bottlenecks, this instrument retains the capability of monochrome CMOS to analyze interference fringes and supports RGB true color imaging, eliminating the limitation of conventional white light interferometers that only generate grayscale images. It clearly presents sample morphology and color details, delivering comprehensive measurement data and intuitive analysis with high reference value, and is well applicable to sophisticated scenarios such as surface defect detection of semiconductor devices.
IV. Upper and Lower Surface Parallelism Measurement for Versatile Application
Featuring a proprietary optical path design, this system can measure the thickness and upper-to-lower surface parallelism of opaque workpieces. It satisfies measurement demands for various opaque precision parts and multi-layer semiconductor devices. The design broadens application scenarios, enhances measurement versatility and cuts costs on purchasing multiple pieces of equipment.
Friction Surface Characterization Cases (For Industrial and Semiconductor Industries)
Comparative friction tests of different lubricantsMeasure scratch depth and wear area of friction surfaces to visually distinguish lubrication performance. It provides data support for optimizing lubrication systems of industrial equipment and maintaining transmission parts of semiconductor devices.
Friction surface measurement of curved rollersDirect quantitative measurement is unfeasible for original curved roller surfaces. After surface flattening, the wear amount can be accurately measured and evaluated. It applies to quality inspection of mechanical transmission components and rollers for semiconductor equipment.
Friction surface characterization after laser drillingConduct texture detection on friction surfaces post laser drilling. It accurately analyzes how process parameters affect the roughness and flatness of friction surfaces, serving semiconductor packaging, precision machining and other sectors.
Roughness measurement of friction surfaces for automotive and semiconductor componentsAchieve precise detection of roughness (Ra/Rz) on automotive friction parts and contact surfaces of semiconductor devices. It delivers authoritative data for component quality control and reliability verification of semiconductor products.
Recrom Optics delivers professional integrated optical 3D measurement solutions. Empowered by core technologies, we serve scenarios including precision measurement, semiconductor characterization and industrial quality inspection, helping diverse industries achieve high-quality development and product iteration and upgrading.