Measurement Challenges:

·  Scratches are shallow, so conventional microscopes cannot accurately identify recessed scratches.

·  The substrate surface is rough with limited field of view, resulting in poor 3D imaging of scratches.

Measurement Challenges:

·  Triangular scanning is prone to obstruction and cannot reach the bottom of holes for detection.

·  Due to insufficient numerical aperture of the lens, it is difficult to measure blind holes with a high aspect ratio.

Measurement Challenges:

·  Micro/nano patterns feature ultra-fine dimensions, exceeding the resolution of conventional microscopic equipment.

·  Periodic array structures restrict the field of view, allowing only partial observation and inspection.

Measurement Challenges:

·  The contact area of the sample is tiny, making measurement difficult for traditional probes.

·  The required measurement accuracy reaches the sub-nanometer level, which conventional equipment cannot achieve.

·  Full-area surface roughness testing is required, while probes can only perform linear roughness measurement.

Measurement Challenges:

·  The inspection requires high precision, which traditional instruments fail to meet.

·  Traditional devices rely on stitching for detection, leading to low working efficiency.

Measurement Challenges:

·  Traditional surface interferometers are only applicable to flat surfaces and cannot test coplanarity of patterned structures.

·  Conventional equipment has a limited field of view, making full-area stitching measurement for large-size patterns difficult.

Measurement Challenges:

·  Traditional surface scanning equipment has limited accuracy and cannot meet the requirements of high-precision microscopic measurement.

·  For free-form surfaces, alignment with CAD drawings is required to conduct topography comparison and deviation evaluation.

Measurement Challenges:

·  Traditional film thickness measuring devices only support single-point detection with limited functions.

·  Special probes of specific wavelength bands are required for different materials, resulting in poor equipment versatility.