Measurement Challenges:

·  Traditional high-precision surface interferometers have insufficient imaging depth and cannot scan workpieces with multiple steps.

·  Conventional 3D imaging equipment delivers low scanning accuracy.

Measurement Challenges:

·  Triangular optical scanning is susceptible to obstruction, causing shadow blind areas in 3D imaging.

·  Laser confocal and depth-of-field synthesis imaging have inadequate depth of field, limiting the scanning range.

Measurement Challenges:

·  Traditional equipment features low resolution and fails to reconstruct complete 3D topography.

·  The R value is selected manually, leading to poor repeat measurement accuracy.

Measurement Challenges:

·  Linear profile inspection is easily affected by workpiece variations, resulting in large manual measurement errors.

·  Traditional high-precision 3D scanners feature a narrow field of view.

Measurement Challenges:

·  High inspection precision is required, which traditional equipment cannot achieve.

·  The conventional stitching measurement method leads to low inspection efficiency.

Measurement Challenges:

·  Traditional equipment lacks sufficient measurement accuracy to meet requirements.

·  The conventional stitching inspection method results in low overall efficiency.

Measurement Challenges:

·  Triangular optical scanning is prone to obstruction, creating shadow blind spots in 3D imaging.

·  Limited numerical aperture of the lens makes it challenging to measure deep holes with a high aspect ratio.

Measurement Challenges:

·  Transmissive 3D imaging is not applicable to non-transparent materials.

·  Position offset often occurs during sampling on upper and lower surfaces, resulting in measurement errors.

Measurement Challenges:

·  The inclined surface effect on curved surfaces degrades 3D imaging quality.

·  Manual picking of passivation R values leads to low repeat measurement precision.